Sulfur containing organosilane precursors for ALD/CVD silicon-containing film applications

ABSTRACT

Disclosed are sulfur containing organosilane precursors, methods of synthesizing the same, and methods of using the same to deposit silicon-containing films using vapor deposition processes for manufacturing semiconductors, photovoltaics, LCD-TFT, flat panel-type devices, refractory materials, or aeronautics. The disclosed precursors have the following formula: 
                         
wherein L 1  is a sulfur atom and L 2  may be chosen from a sulfur atom, an oxygen atom, or a nitrogen atom; L 1  and L 2  are joined together via a carbon bridge having one to three carbon atoms; and L 1 , L 2  and the carbon bridge form a monoanionic ligand bonded to silicon.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. provisional application No. 61/856,650, filed Jul. 19, 2013, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

Disclosed are organosilane precursors, methods of synthesizing the same, and methods of using the same to deposit silicon-containing films using vapor deposition processes for manufacturing semiconductors, photovoltaics, LCD-TFT, flat panel-type devices, refractory materials, or aeronautics.

BACKGROUND

Si-containing thin films are used widely in the semiconductor, photovoltaic, LCD-TFT, flat panel-type device, refractory material, or aeronautic industries. Si-containing thin films may be used, for example, as dielectric materials having electrical properties which may be insulating (SiO₂, SiN, SiCN, SiCOH, MSiOx, wherein x is greater than zero), Si-containing thin films may be used as conducting films, such as metal silicides or metal silicon nitrides. Due to the strict requirements imposed by downscaling of electrical device architectures towards the nanoscale (especially below 28 nm node), increasingly fine-tuned molecular precursors are required which meet the requirements of volatility (for ALD process), lower process temperatures, reactivity with various oxidants and low film contamination, in addition to high deposition rates, conformality and consistency of films produced.

Organoaminosilanes have been used as precursors for CVD of Si-containing films. U.S. Pat. No. 7,192,626 to Dussarrat et al. reports the use of trisilylamine N(SiH₃)₃ for deposition of SiN films. Other reported precursors include diisopropylaminosilane [SiH₃(NiPr₂)] and analogous SiH₃(NR₂) compounds (see, e.g., U.S. Pat. No. 7,875,312 to Thridandam et al.) and phenylmethylaminosilane [SiH₃(NPhMe)] and related substituted silylanilines (see, e.g., EP 2392691 to Xiao et al.).

Hunks et al. disclose a wide range of Si-containing precursors in US2010/0164057, including silicon compounds having the formula R_(4-x)SiL_(x), wherein x is an integer having a value from 1 to 3; R may be selected from H, branched and unbranched C1-C6 alkyl, C3-C8 cycloalkyl, and C6-C13 aryl groups; and L may be selected from isocyanato, methylethylketoxime, trifluoroacetate, triflate, acyloxy, β-diketiminate, β-di-iminate, amidinate, guanidinate, alkylamino, hydride, alkoxide, or format ligands. Pinnavaia et al. claim a method for the preparation of a porous synthetic, semi-crystalline hybrid organic-inorganic silicon oxide composition from silicon acetylacetonate and silicon 1,3-diketonate precursors (U.S. Pat. No. 6,465,387).

Penta- and hexa-coordinate sulfur containing silicon compounds are also known in the art (see, e.g., Baus et al., Neutral Six-Coordinate and Cationic Five-Coordinate Silicon (IV) Complexes with Two Bidentate Monoanionic N,S-Pyridine-2-thiolato(-) Ligands, Inorganic Chemistry (2013), 52 (18), 10664-10676; Synthesis and characterization of pyrrolidine-N-carbodiothioate and its Group IV metal complexes, Siddiqi et al., Synthesis and Reactivity in Inorganic and Metal-Organic Chemistry (1994) 24 (3), 353-63; U.S. Pat. No. 2,590,039 to Richter et al.).

Despite the wide range of choices available for the deposition of Si containing films, additional precursors are continuously sought to provide device engineers the ability to tune manufacturing process requirements and achieve films with desirable electrical and physical properties.

NOTATION AND NOMENCLATURE

Certain abbreviations, symbols, and terms are used throughout the following description and claims, and include:

As used herein, the indefinite article “a” or “an” means one or more.

As used herein, the term “independently” when used in the context of describing R groups should be understood to denote that the subject R group is not only independently selected relative to other R groups bearing the same or different subscripts or superscripts, but is also independently selected relative to any additional species of that same R group. For example in the formula MR¹ _(X)(NR²R³)_((4-x)), where x is 2 or 3, the two or three R¹ groups may, but need not be identical to each other or to R² or to R³. Further, it should be understood that unless specifically stated otherwise, values of R groups are independent of each other when used in different formulas.

As used herein, the term “alkyl group” refers to saturated functional groups containing exclusively carbon and hydrogen atoms. Further, the term “alkyl group” refers to linear, branched, or cyclic alkyl groups. Examples of linear alkyl groups include without limitation, methyl groups, ethyl groups, propyl groups, butyl groups, etc. Examples of branched alkyls groups include without limitation, t-butyl. Examples of cyclic alkyl groups include without limitation, cyclopropyl groups, cyclobutyl groups, cyclopentyl groups, cyclohexyl groups, etc.

As used herein, the term “aryl” refers to aromatic ring compounds where one hydrogen atom has been removed from the ring. As used herein, the term “heterocycle” refers to a cyclic compound that has atoms of at least two different elements as members of its ring.

As used herein, the abbreviation “Me” refers to a methyl group; the abbreviation “Et” refers to an ethyl group; the abbreviation “Pr” refers to any propyl group (i.e., n-propyl or isopropyl); the abbreviation “iPr” refers to an isopropyl group; the abbreviation “Bu” refers to any butyl group (n-butyl, iso-butyl, t-butyl, sec-butyl); the abbreviation “tBu” refers to a tert-butyl group; the abbreviation “sBu” refers to a sec-butyl group; the abbreviation “iBu” refers to an iso-butyl group; the abbreviation “ph” refers to a phenyl group; the abbreviation “Am” refers to any amyl group (iso-amyl, sec-amyl, tert-amyl); the abbreviation “Cy” refers to a cyclic alkyl group (cyclobutyl, cyclopentyl, cyclohexyl, etc.); and the abbreviation “N^(Z)-amd” refers to ZNC(CH₃)═NZ, wherein Z is a defined alkyl group such as iPr or tBu.

As used herein, the acronym “SRO” stands for a Strontium Ruthenium Oxide film; the acronym “HCDS” stands for hexachlorodisilane; and the acronym “PODS” stands for pentachlorodisilane.

The standard abbreviations of the elements from the periodic table of elements are used herein. It should be understood that elements may be referred to by these abbreviations (e.g., Si refers to silicon, S refers to sulfur, N refers to nitrogen, O refers to oxygen, C refers to carbon, etc.)

SUMMARY

Disclosed are molecules having the following formula:

wherein L¹ is a sulfur atom and L² may be chosen from a sulfur atom, an oxygen atom, or a nitrogen atom; L¹ and L² are joined together via a carbon bridge having one to three carbon atoms; and L¹, L² and the carbon bridge form a monoanionic ligand bonded to silicon. The disclosed molecules may have one or more of the following aspects:

-   -   the molecule having the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group;

-   -   R¹ and R² joined to form cyclic chains;     -   R² and R³ joined to form cyclic chains;     -   R¹ and R² not joined to form cyclic chains;     -   R² and R³ not joined to form cyclic chains;     -   R¹ being Me, Et, Pr, or Bu;     -   R² being H, Me, Et, Pr, or Bu;     -   R³ being Me, Et, Pr, or Bu;     -   the molecule having the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group;

-   -   R¹ and R² joined to form a cyclic chain;     -   R¹ and R² not joined to form cyclic chains;     -   R¹ being H, Me, Et, or Pr;     -   R² being H, Me, Et, or Pr;     -   the molecule having the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group;

-   -   R¹ being H, Me, Et, Pr, or Bu;     -   R¹ being H;     -   R¹ being Me;     -   the molecule having the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group;

-   -   R¹ and R² joined to form cyclic chains;     -   R² and R³ joined to form cyclic chains;     -   R¹ and R² not joined to form cyclic chains;     -   R² and R³ not joined to form cyclic chains;     -   R¹ being Me, Et, Pr, or Bu;     -   R² being H, Me, Et, Pr, or Bu;     -   R³ being Me, Et, Pr, or Bu;     -   the molecule having the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group;

-   -   R¹ and R² joined to form a cyclic chain; and     -   R¹ and R² not joined to form cyclic chains;     -   R¹ being H, Me, Et, or Pr;     -   R² being H, Me, Et, or Pr;     -   the molecule having the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle.

-   -   R¹ being H, Me, Et, Pr, or Bu;     -   R¹ being H;     -   R¹ being Me;     -   the molecule having the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle;

-   -   R¹ and R² joined to form cyclic chains;     -   R² and R³ joined to form cyclic chains;     -   R³ and R⁴ joined to form cyclic chains;     -   R¹ and R² not joined to form cyclic chains;     -   R² and R³ not joined to form cyclic chains;     -   R³ and R⁴ not joined to form cyclic chains;     -   R¹ being Me, Et, Pr, or Bu;     -   R² being H, Me, Et, or Pr;     -   R³ being Me, Et, Pr, or Bu;     -   R⁴ being Me, Et, Pr, or Bu;     -   the molecule having the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle;

-   -   R¹ and R² joined to form cyclic chains;     -   R² and R³ joined to form cyclic chains;     -   R¹ and R² not joined to form cyclic chains;     -   R² and R³ not joined to form cyclic chains;     -   R¹ being H, Me, Et, or Pr;     -   R² being H, Me, Et, or Pr;     -   R³ being Me, Et, Pr, or Bu;     -   the molecule having the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle;

-   -   R¹ and R² joined to form cyclic chains;     -   R¹ and R² not joined to form cyclic chains;     -   R¹ being H, Me, Et, Pr, or Bu; and     -   R² being Me, Et, Pr, or Bu.

Also disclosed are methods of depositing a Si-containing layer on a substrate.

The organosilane precursor disclosed above is introduced into a reactor having a substrate disposed therein. At least part of the organosilane precursor is deposited onto the substrate to form a Si-containing layer using a vapor deposition method. The disclosed methods may have one or more of the following aspects:

-   -   introducing into the reactor a vapor comprising at least one         second precursor;     -   an element of the at least one second precursor being selected         from the group consisting of group 2, group 13, group 14,         transition metal, lanthanides, and combinations thereof;     -   the element of the at least one second precursor being selected         from Mg, Ca, Sr, Ba, Zr, Hf, Ti, Nb, Ta, Al, Si, Ge, Y, or         lanthanides;     -   introducing into the reactor at least one co-reactant;     -   the co-reactant being selected from the group consisting of O₂,         O₃, H₂O, H₂O₂, NO, NO₂, a carboxylic acid, radicals thereof, and         combinations thereof;     -   the co-reactant being plasma treated oxygen;     -   the co-reactant being ozone;     -   the Si-containing layer being a silicon oxide layer;     -   the co-reactant being selected from the group consisting of H₂,         NH₃, (SiH₃)₃N, hydridosilanes (such as SiH₄, Si₂H₆, Si₃H₈,         Si₄H₁₀, Si₅H₁₀, Si₆H₁₂), chlorosilanes and chloropolysilanes         (such as SiHCl₃, SiH₂Cl₂, SiH₃CI, Si₂Cl₆, Si₂HCl₅, Si₃Cl₈),         alkysilanes (such as Me₂SiH₂, Et₂SiH₂, MeSiH₃, EtSiH₃),         hydrazines (such as N₂H₄, MeHNNH₂, MeHNNHMe), organic amines         (such as NMeH₂, NEtH₂, NMe₂H, NEt₂H, NMe₃, NEt₃, (SiMe₃)₂NH),         pyrazoline, pyridine, B-containing molecules (such as         B₂H₆,9-borabicylo[3,3,1]none, trimethylboron, triethylboron,         borazine), alkyl metals (such as trimethylaluminum,         triethylaluminum, dimethylzinc, diethylzinc), radical species         thereof, and mixtures thereof.     -   the co-reactant being selected from the group consisting of H₂,         NH₃, SiH₄, Si₂H₆, Si₃H₈, SiH₂Me₂, SiH₂Et₂, N(SiH₃)₃, hydrogen         radicals thereof, and mixtures thereof;     -   the co-reactant being plasma-treated;     -   the co-reactant being remote plasma-treated;     -   the co-reactant not being plasma-treated;     -   the co-reactant being H₂;     -   the co-reactant being NH₃;     -   the co-reactant being HCDS;     -   the co-reactant being PODS;     -   the co-reactant being tetrachlorosilane;     -   the co-reactant being trichlorosilane;     -   the co-reactant being hexachlorocyclohexasilane;     -   the vapor deposition process being a chemical vapor deposition         process;     -   the vapor deposition process being an atomic layer deposition         (ALD) process; and     -   the vapor deposition process being a spatial ALD process.

DESCRIPTION OF PREFERRED EMBODIMENTS

Disclosed are Si-containing thin film forming precursors, methods of synthesizing the same, and methods of using the same to deposit silicon-containing films using vapor deposition processes for manufacturing semiconductors.

The disclosed Si-containing thin film forming precursors have the following formula:

wherein L¹ is a sulfur atom and L² is chosen from either a sulfur atom, an oxygen atom or a nitrogen atom; L¹ and L² are joined together via a carbon bridge having one to three carbon atoms; and L¹, L², and the carbon bridge form a monoanionic ligand bonded to silicon. As illustrated in the formula, the L¹ and L² atoms are bonded to the silicon atom, resulting in a pentacoordinate Si (IV) center. The carbon atoms in the carbon bridge may be sp² hybridized, resulting in a delocalized charge across the monoanionic ligand. Alternatively, the carbon atoms in the carbon bridge may be either sp³ hybridized or some combination of sp² and sp³ hybridized, resulting in a negative charge on one of L¹ or L² and resulting in a neutral charge on the other of L¹ or L². Each of the atoms in the monoanionic ligand may independently be substituted by H, C1-C6 alkyl groups, aryl groups, or heterocycle groups.

The disclosed organosilane precursors may be more reactive than other R_(4-x)SiL_(x) precursors due to hypercoordination at the silicon atom. In other words, although the silicon atom is +IV, the three hydrogen bonds and the monoanionic chelating ligand results in a total of 5 bonds to the silicon atom. Due to the high electron polarizability of sulfur, electron density may increase on the Si center to provide increased surface reactivity. Additionally the incorporation of sulfur into the ligand structure allows the formation of low molecular weight, highly volatile and stable compounds.

When L¹ and L² are both sulfur, the disclosed molecules may be used to produce silicon-containing films such as SiO₂, SiOC, or SiON, SiCN depending upon the co-reactant employed.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group. The three carbon atoms are sp² hybridized. If R¹ and R³ are the same (e.g., both Me), the resulting nuclear magnetic transform Fourier-Transform Infra Red (FTIR) spectra for these molecules will produce one peak for both of the S atoms due to the delocalization of the electrons across the ligand.

Preferred β-dithioketonatosilane precursors include:

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², R³, and R⁴ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group. The three carbon atoms may be sp² or sp³ hybridized. An anionic charge may be localized at one of the sulfur atoms. The other sulfur atom may form a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the three carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₃S] and H₃Si[R¹S(CR)₃S] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₃S] or M[R¹S(CR)₃S], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₃S] and H₃Si[R¹S(CR)₃S] precursors is by reaction of the protonated ligand (HS(CR)₃S or R¹S(CR)₃SH) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₃S] and H₃Si[R¹S(CR)₃S] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., Li[S(CR)₃S] or Li[R¹S(CR)₃S]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds Li[S(CR)₃S] or Li[R¹S(CR)₃S] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate hydroxy thione or hydroxy thioether (i.e., R¹S—CR²—CR³—CR⁴—SH, S═CR¹—CR²—CR³—SH, and S═CR¹—CR²═CR³—SH). One of ordinary skill in the art would recognize that proper selection of the ligand will result in the saturated or unsaturated precursor.

Exemplary organosilane precursors may have the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group. The two carbon atoms may be sp² or sp³ hybridized. The formula above illustrates an anionic charge localized at the “bottom” sulfur atom. The sulfur atom having the double bond to C(R¹) forms a dative bond to the silicon atom. However, one of ordinary skill in the art will recognize that the double bond may also be delocalized across the ring when the carbon atoms are sp² hybridized. If R¹ and R² are the same (e.g., both Me), the resulting Fourier-transform Infra Red (FTIR) spectra for the delocalized molecules will produce one peak for both of the S atoms due to the delocalization of the electrons across the ligand.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group. The two carbon atoms may be sp2 or sp3 hybrizidized. An anionic charge may be localized at one of the sulfur atoms. The other sulfur atom may form a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the two carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₂S] and H₃Si[R¹S(CR)₂S] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₂S] or M[R¹S(CR)₂S], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₂S] and H₃Si[R¹S(CR)₂S] precursors is by reaction of the protonated ligand (HS(CR)₂S or R¹S(CR)₂SH) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₂S] and H₃Si[R¹S(CR)₂S] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., Li[S(CR)₂S] or Li[R¹S(CR)₂S]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[S(CR)₂S] or M[R¹S(CR)₂S] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate hydroxy thione or hydroxy thioether (i.e., R¹S—CR²—CR³—SH or S═CR¹—CR²—SH). One of ordinary skill in the art would recognize that proper selection of the ligand will result in the saturated hydroxy thione or unsaturated hydroxyl thioether precursor.

Exemplary organosilane precursors may have the following formula:

wherein R² may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The carbon atom is sp² hybridized.

Exemplary (dithioacetato)silane precursors include:

The H₃Si[SC(R¹)S] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[SC(R¹)S], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[SC(R¹)S] precursors is by reaction of the protonated ligand (HSC(R¹)═S) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[SC(R¹)S] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[SC(R¹)S], wherein M is Li, Na, or K) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[SC(R¹)S] all of the starting materials are commercially available. The ligand compound may be synthesized by addition of carbon disulfide (i.e., S═C═S) into a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium).

When L¹ is S and L² is O, the disclosed molecules may be used to produce silicon-containing films that also contain oxygen, such as SiO₂, SiOC, or SiON, or to tune the amount of oxygen in a SiO₂, SiOC, or SiON containing film.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The three carbon atoms are sp² hybridized and charge may be delocalized around the heterocycle.

Exemplary β-thiodiketonatosilane precursors include:

Exemplary alkoxythioether organosilane precursors may have the following formula:

wherein R¹, R², R³, and R⁴ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The three carbon atoms may be sp² or sp³ hybridized. An anionic charge may be localized at either the oxygen or sulfur atoms. The other chalcogen atom may form a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the three carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₃O] and H₃Si[R¹S(CR)₃O] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₃O] or M[R¹S(CR)₃O], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₃O] and H₃Si[R¹S(CR)₃O] precursors is by reaction of the protonated ligand (HS(CR)₃O or R¹S(CR)₃OH) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₃O] and H₃Si[R¹S(CR)₃O] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[S(CR)₃O] or M[R¹S(CR)₃O]) and subsequent reduction using a selected metal hydride such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[S(CR)₃O] or M[R¹S(CR)₃O] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate hydroxy thione or hydroxy thioether or ketothione (i.e., R¹S—CR²—CR³—CR⁴—OH, S═CR¹—CR²—CR³—OH, and O═CR¹—CR²═CR³—SH).

Exemplary organosilane precursors may have the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The two carbon atoms may be sp² or sp³ hybridized. The formula above illustrates an anionic charge localized at the oxygen atom. The sulfur atom having the double bond to C(R¹) forms a dative bond to the silicon atom. However, one of ordinary skill in the art will recognize that the double bond may also be delocalized across the ring when the carbon atoms are sp² hybridized.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The two carbon atoms may be sp² or sp³ hybridized. An anionic charge may be localized at the oxygen atom with the sulfur atom forming a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the two carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₂O] and H₃Si[R¹S(CR)₂O] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃ ⁻), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₂O] or M[R¹S(CR)₂O], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₂O] and H₃Si[R¹S(CR)₂O] precursors is by reaction of the protonated ligand (HS(CR)₂O or R¹S(CR)₂OH) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₂O] and H₃Si[R¹S(CR)₂O] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[S(CR)₂O] or M[R¹S(CR)₂O]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[S(CR)₂O] or M[R¹S(CR)₂O] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate hydroxy thione or hydroxy thioether (i.e., R¹S—CR²—CR³—OH or S═CR¹—CR²—OH).

Exemplary organosilane precursors may have the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The carbon atom is sp² hybridized.

Exemplary thioacetatosilane precursors include:

The H₃Si[SC(R¹)O] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[SC(R¹)O], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[SC(R¹)O] precursors is by reaction of the protonated ligand (HSC(R¹)═O) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[SC(R¹)O] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[SC(R¹)O]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[SC(R¹)O] all of the starting materials are commercially available. The ligand compound may be synthesized by bubbling carbonyl sulfide (i.e., O═C═S) into a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium).

When L¹ is S and L² is N, the disclosed molecules may be used to produce silicon-containing films that also contain nitrogen, such as SiN, SiOCN, or SiON, or to tune the amount of nitrogen in a SiN, SiOCN, or SiON containing film.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The three carbon atoms are sp² hybridized.

Exemplary β-thioketiminatosilane precursors include:

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², R³, R⁴ and R⁵ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The three carbon atoms may be sp² or sp³ hybridized. An anionic charge may be localized at the nitrogen atom. The sulfur atom may form a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the three carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₃NR⁴] and H₃Si[R¹S(CR)₃NR⁵] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₃NR₄] or M[R¹S(CR)₃NR⁵], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₃NR⁴] and H₃Si[R¹S(CR)₃NR⁵] precursors is by reaction of the protonated ligand (HS(CR)₃NR⁴ or R¹S(CR)₃NR⁵H) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₃NR⁴] and H₃Si[R¹S(CR)₃NR⁵] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[S(CR)₃NR⁴] or M[R¹S(CR)₃NR⁵]) and subsequent reduction using a selected metal hydride such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[S(CR)₃NR⁴] or M[R¹S(CR)₃NR⁵] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate thiohydroxy ketimine or aminothioether (i.e., HS—CR¹—CR²—CR³—NR⁴ or S═CR¹—CR²—CR³—NHR).

Exemplary organosilane precursors may have the following formula:

wherein R¹, R² and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The two carbon atoms may be sp² or sp³ hybridized. The formula above illustrates an anionic charge localized at the nitrogen atom. The sulfur atom forms a dative bond to the silicon atom. However, one of ordinary skill in the art will recognize that the double bond may also be delocalized across the ring when the carbon atoms are sp² hybridized.

Exemplary organosilane precursors may have the following formula:

wherein R¹, R², R³ and R⁴ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The two carbon atoms may be sp² or sp³ hybridized. An anionic charge may be localized at the nitrogen atom. The sulfur atom may form a dative bond to the Si atom. Due to the unsymmetrical nature of the ligand, the two carbon atoms will produce different peaks in nuclear magnetic resonance (NMR) spectra.

The H₃Si[S(CR)₂NR³] and H₃Si[R¹S(CR)₂NR⁴] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[S(CR)₂NR³] or M[R¹S(CR)₂NR⁴], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[S(CR)₂NR³] and H₃Si[R¹S(CR)₂NR⁴] precursors is by reaction of the protonated ligand (HS(CR)₂NR³ or R¹S(CR)₂NR⁴H) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[S(CR)₂NR³] and H₃Si[R¹S(CR)₂NR⁴] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[S(CR)₂NR³] or M[R¹S(CR)₂NR⁴]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[S(CR)₂NR³] or M[RS(CR)₂NR³] all of the starting materials are commercially available. The ligand compound may be synthesized by combining a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium) to a hydrocarbon solution of the appropriate thiohydroxy ketimine or aminothioether (i.e., R¹S—CR²—CR³—NR⁴ or HS═CR¹—CR²—NR³).

Exemplary organosilane precursors may have the following formula:

wherein R¹ and R² may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle. The carbon atom is sp² hybridized.

Exemplary thioamidinatosilane precursors include:

The H₃Si[SC(R¹) NR²] precursors may be synthesized by combining a hydrocarbon solution of SiXH₃, wherein X is Cl, Br, I, or triflate (SO₃CF₃), with a neat or hydrocarbon solution of the ligand compound, such as M[SC(R¹) NR²], wherein M is Li, Na, or K, under atmosphere of nitrogen, the outlet of the mixing flask being connected to an oil bubbler to inhibit backflow of air and moisture.

A second synthetic route to the disclosed H₃Si[SC(R¹) NR²] precursors is by reaction of the protonated ligand (HSC(R¹)NR²) with either a neat or a hydrocarbon solution of a dialkylaminosilane [SiH₃(NR₂)] performed under an inert atmosphere.

Alternatively, the disclosed H₃Si[SC(R¹) NR²] precursors may be synthesized by reaction of SiH_(n)Cl_(4-n) with a single equivalent of the ligand compound (i.e., M[SC(R¹) NR²]) and subsequent reduction using a selected metal hydride, such as LAH (lithium aluminum hydride).

In all three synthesis routes, the resulting solution may be stirred at room temperature overnight. Exemplary hydrocarbon solutions suitable for these synthesis methods include diethyl ether, pentane, hexane, or toluene. The resulting suspension is filtered and the resulting solution distilled to remove solvent. Purification of the resulting liquid or solid is carried out by distillation or sublimation, respectively. Except for the ligand compounds M[SC(R¹) NR²] all of the starting materials are commercially available. The ligand compound may be synthesized by the addition of a hydrocarbon solution of isothiocyanate (i.e., S═C═NR) into a hydrocarbon solution of metalorganic salt (i.e., alkyl lithium).

To ensure process reliability, the pentacoordinate silicon-containing molecule may be purified by continuous or fractional batch distillation or sublimation prior to use to a purity ranging from approximately 95% w/w to approximately 100% w/w, preferably ranging from approximately 99% w/w to approximately 100% w/w. The pentacoordinate silicon-containing precursor may contain any of the following impurities: bis-, tris-, or tetra-substituted analogs; reactants; solvents; chlorinated metal compounds; or other reaction products. Preferably, the total quantity of these impurities is below 0.1% w/w.

The concentration of each of hexane, substituted hexane, pentane, substituted pentane, dimethyl ether, or anisole in the purified pentacoordinate silicon-containing molecule may range from approximately 0% w/w to approximately 5% w/w, preferably from approximately 0% w/w to approximately 0.1% w/w. Solvents may be used in the precursor's synthesis. Separation of the solvents from the precursor may be difficult if both have similar boiling points. Cooling the mixture may produce solid precursor in liquid solvent, which may be separated by filtration. Vacuum distillation may also be used, provided the precursor product is not heated above approximately its decomposition point.

In one embodiment the disclosed organosilane precursor contains less than 5% v/v, preferably less than 1% v/v, more preferably less than 0.1% v/v, and even more preferably less than 0.01% v/v of any of its bis-, tris-, or tetra-substituted analogs, reactants, or other reaction products. This embodiment may provide better process repeatability. This embodiment may be produced by distillation of the pentacoordinate organosilane precursor. In an alternate embodiment, the disclosed organosilane precursor may contain between 5% v/v and 50% v/v of one or more of its bis-, tris-, or tetra-substituted analogs, reactants, or other reaction products, particularly when the mixture provides improved process parameters or isolation of the target compound is too difficult or expensive. For example, a mixture of reaction products may produce a stable, liquid mixture suitable for vapor deposition.

The concentration of trace metals and metalloids in the purified pentacoordinate silicon-containing molecule may each range from approximately 0 ppb to approximately 100 ppb, and more preferably from approximately 0 ppb to approximately 10 ppb. The concentration of X (wherein X=CI, Br, I, or F) in the purified pentacoordinate silicon-containing molecule may range from approximately 0 ppm to approximately 100 ppm and more preferably from approximately 0 ppm to approximately 10 ppm.

Also disclosed are methods of using the disclosed organosilane precursors for vapor deposition methods. The disclosed methods provide for the use of the organosilane precursors for deposition of silicon-containing films. The disclosed methods may be useful in the manufacture of semiconductor, photovoltaic, LCD-TFT, or flat panel type devices. The method includes: introducing the vapor of the disclosed organosilane precursors into a reactor having at least one substrate disposed therein: and using a vapor deposition process to deposit at least part of the disclosed organosilane precursor onto the substrate to form a Si-containing layer.

The disclosed methods also provide for forming a bimetal-containing layer on a substrate using a vapor deposition process and, more particularly, for deposition of SiMO_(x) films, wherein x may be 0-4 and M is Ta, Hf, Nb, Mg, Al, Sr, Y, Ba, Ca, As, Sb, Bi, Sn, Pb, Co, lanthanides (such as Er), or combinations thereof.

The disclosed methods of forming silicon-containing layers on substrates may be useful in the manufacture of semiconductor, photovoltaic, LCD-TFT, or flat panel type devices. The disclosed organosilane precursors may deposit Si-containing films using any vapor deposition methods known in the art. Examples of suitable vapor deposition methods include chemical vapor deposition (CVD) or atomic layer deposition (ALD). Exemplary CVD methods include thermal CVD, plasma enhanced CVD (PECVD), pulsed CVD (PCVD), low pressure CVD (LPCVD), sub-atmospheric CVD (SACVD) or atmospheric pressure CVD (APCVD), hot-wire CVD (HWCVD, also known as cat-CVD, in which a hot wire serves as an energy source for the deposition process), radicals incorporated CVD, and combinations thereof. Exemplary ALD methods include thermal ALD, plasma enhanced ALD (PEALD), spatial isolation ALD, hot-wire ALD (HWALD), radicals incorporated ALD, and combinations thereof. Super critical fluid deposition may also be used. The disclosed methods may also be used in the flowable PECVD deposition processes described in U.S. Pat. App. Pub. No. 2014/0051264 to Applied Materials, Inc., the contents of which is incorporated herein in its entirety. The deposition method is preferably ALD, spatial ALD, or PE-ALD.

The vapor of the organosilane precursor is introduced into a reaction chamber containing at least one substrate. The temperature and the pressure within the reaction chamber and the temperature of the substrate are held at conditions suitable for vapor deposition of at least part of the organosilane precursor onto the substrate. In other words, after introduction of the vaporized precursor into the chamber, conditions within the chamber are such that at least part of the vaporized precursor is deposited onto the substrate to form the silicon-containing film. A co-reactant may also be used to help in formation of the Si-containing layer.

The reaction chamber may be any enclosure or chamber of a device in which deposition methods take place, such as, without limitation, a parallel-plate type reactor, a cold-wall type reactor, a hot-wall type reactor, a single-wafer reactor, a multi-wafer reactor, or other such types of deposition systems. All of these exemplary reaction chambers are capable of serving as an ALD reaction chamber. The reaction chamber may be maintained at a pressure ranging from about 0.5 mTorr to about 20 Torr. In addition, the temperature within the reaction chamber may range from about 20° C. to about 600° C. One of ordinary skill in the art will recognize that the temperature may be optimized through mere experimentation to achieve the desired result.

The temperature of the reactor may be controlled by either controlling the temperature of the substrate holder or controlling the temperature of the reactor wall. Devices used to heat the substrate are known in the art. The reactor wall is heated to a sufficient temperature to obtain the desired film at a sufficient growth rate and with desired physical state and composition. A non-limiting exemplary temperature range to which the reactor wall may be heated includes from approximately 20° C. to approximately 600° C. When a plasma deposition process is utilized, the deposition temperature may range from approximately 20° C. to approximately 550° C. Alternatively, when a thermal process is performed, the deposition temperature may range from approximately 300° C. to approximately 600° C.

Alternatively, the substrate may be heated to a sufficient temperature to obtain the desired silicon-containing film at a sufficient growth rate and with desired physical state and composition. A non-limiting exemplary temperature range to which the substrate may be heated includes from 150° C. to 600° C. Preferably, the temperature of the substrate remains less than or equal to 500° C.

The type of substrate upon which the silicon-containing film will be deposited will vary depending on the final use intended. A substrate is generally defined as the material on which a process is conducted. The substrates may be any suitable substrate used in semiconductor, photovoltaic, flat panel, or LCD-TFT device manufacturing. Examples of suitable substrates include wafers, such as silicon, silica, glass, Ge, or GaAs wafers. The wafer may have one or more layers of differing materials deposited on it from a previous manufacturing step. For example, the wafers may include silicon layers (crystalline, amorphous, porous, etc.), silicon oxide layers, silicon nitride layers, silicon oxy nitride layers, carbon doped silicon oxide (SiCOH) layers, or combinations thereof. Additionally, the wafers may include copper layers, tungsten layers or metal layers (e.g. platinum, palladium, nickel, rhodium, or gold). The wafers may include barrier layers, such as manganese, manganese oxide, tantalum, tantalum nitride, etc. Plastic layers, such as poly(3,4-ethylenedioxythiophene)poly (styrenesulfonate) [PEDOT:PSS] may also be used. The layers may be planar or patterned. In some embodiments, the substrate may be a patterned photoresist film made of hydrogenated carbon, for example CH_(x), wherein x is greater than zero (e.g., x≦4). In some embodiments, the substrate may include layers of oxides which are used as dielectric materials in MIM, DRAM, or FeRam technologies (for example, ZrO₂ based materials, HfO₂ based materials, TiO₂ based materials, rare earth oxide based materials, ternary oxide based materials, etc.) or from nitride-based films (for example, TaN) that are used as an oxygen barrier between copper and the low-k layer. The disclosed processes may deposit the silicon-containing layer directly on the wafer or directly on one or more than one (when patterned layers form the substrate) of the layers on top of the wafer. Furthermore, one of ordinary skill in the art will recognize that the terms “film” or “layer” used herein refer to a thickness of some material laid on or spread over a surface and that the surface may be a trench or a line. Throughout the specification and claims, the wafer and any associated layers thereon are referred to as substrates. The actual substrate utilized may also depend upon the specific precursor embodiment utilized. In many instances though, the preferred substrate utilized will be selected from hydrogenated carbon, TiN, SRO, Ru, and Si type substrates, such as polysilicon or crystalline silicon substrates.

The disclosed organosilane precursors may be supplied either in neat form or in a blend with a suitable solvent, such as toluene, ethyl benzene, xylene, mesitylene, decane, dodecane, octane, hexane, pentane, tertiary amines, acetone, tetrahydrofuran, ethanol, ethylmethylketone, 1,4-dioxane, or others. The disclosed precursors may be present in varying concentrations in the solvent. For example, the resulting concentration may range from approximately 0.05 M to approximately 2 M.

The neat or blended organosilane precursors are introduced into a reactor in vapor form by conventional means, such as tubing and/or flow meters. The precursor in vapor form may be produced by vaporizing the neat or blended precursor solution through a conventional vaporization step such as direct vaporization, distillation, by bubbling, or by using a sublimator such as the one disclosed in PCT Publication WO2009/087609 to Xu et al. The neat or blended precursor may be fed in liquid state to a vaporizer where it is vaporized before it is introduced into the reactor. Alternatively, the neat or blended precursor may be vaporized by passing a carrier gas into a container containing the precursor or by bubbling the carrier gas into the precursor. The carrier gas may include, but is not limited to, Ar, He, or N₂, and mixtures thereof. Bubbling with a carrier gas may also remove any dissolved oxygen present in the neat or blended precursor solution. The carrier gas and precursor are then introduced into the reactor as a vapor.

If necessary, the container may be heated to a temperature that permits the organosilane precursor to be in its liquid phase and to have a sufficient vapor pressure. The container may be maintained at temperatures in the range of, for example, 0-150° C. Those skilled in the art recognize that the temperature of the container may be adjusted in a known manner to control the amount of organosilane precursor vaporized.

In addition to the disclosed precursor, a reaction gas may also be introduced into the reactor. The reaction gas may be an oxidizing agent such as one of O₂; O₃; H₂O; H₂O₂; oxygen containing radicals such as O. or OH.; NO; NO₂; carboxylic acids such as formic acid, acetic acid, propionic acid; radical species of NO, NO₂, or the carboxylic acids; para-formaldehyde; and mixtures thereof. Preferably, the oxidizing agent is selected from the group consisting of O₂, O₃, H₂O, H₂O₂, oxygen containing radicals thereof such as O. or OH., and mixtures thereof. Preferably, when an ALD process is performed, the co-reactant is plasma treated oxygen, ozone, or combinations thereof. When an oxidizing gas is used, the resulting silicon containing film will also contain oxygen.

Alternatively, the reaction gas may be a reducing agent such as one of H₂, NH₃, (SiH₃)₃N, hydridosilanes (such as SiH₄, Si₂H₆, Si₃H₈, Si₄H₁₀, Si₅H₁₀, Si₆H₁₂), chlorosilanes and chloropolysilanes (such as SiHCl₃, SiH₂Cl₂, SiH₃Cl, Si₂Cl₆, Si₂HCl₅, Si₃Cl₈), alkylsilanes (such as (CH₃)₂SiH₂, (C₂H₅)₂SiH₂, (CH₃)SiH₃, (C₂H₅)SiH₃), hydrazines (such as N₂H₄, MeHNNH₂, MeHNNHMe), organic amines (such as N(CH₃)H₂, N(C₂H₅)H₂, N(CH₃)₂H, N(C₂H₅)₂H, N(CH₃)₃, N(C₂H₅)₃, (SiMe₃)₂NH), pyrazoline, pyridine, B-containing molecules (such as B₂H₆, 9-borabicyclo[3,3,1]none, trimethylboron, triethylboron, borazine), alkyl metals (such as trimethylaluminum, triethylaluminum, dimethylzinc, diethylzinc), radical species thereof, and mixtures thereof. Preferably, the reducing agent is H₂, NH₃, SiH₄, Si₂H₆, Si₃H₈, SiH₂Me₂, SiH₂Et₂, N(SiH₃)₃, hydrogen radicals thereof, or mixtures thereof. When a reducing agent is used, the resulting silicon containing film may be pure Si.

The reaction gas may be treated by a plasma, in order to decompose the reaction gas into its radical form. N₂ may also be utilized as a reducing agent when treated with plasma. For instance, the plasma may be generated with a power ranging from about 50 W to about 500 W, preferably from about 100 W to about 200 W. The plasma may be generated or present within the reactor itself. Alternatively, the plasma may generally be at a location removed from the reactor, for instance, in a remotely located plasma system. One of skill in the art will recognize methods and apparatus suitable for such plasma treatment.

When the desired silicon-containing film also contains another element, such as, for example and without limitation, Ta, Hf, Nb, Mg, Al, Sr, Y, Ba, Ca, As, Sb, Bi, Sn, Pb, Co, lanthanides (such as Er), or combinations thereof, the co-reactants may include a metal-containing precursor which is selected from, but not limited to, metal alkyls, such as Ln(RCp)₃ or Co(RCp)₂, metal amines, such as Nb(Cp)(NtBu)(NMe₂)₃ and any combination thereof.

The disclosed organosilane precursors may also be used with a halosilane or polyhalodisilane, such as hexachlorodisilane pentachlorodisilane, or tetrachlorodisilane, and one or more co-reactant gases to form SiN or SiCN films, as disclosed in PCT Publication Number WO2011/123792, the entire contents of which are incorporated herein in their entireties.

The organosilane precursor and one or more co-reactants may be introduced into the reaction chamber simultaneously (chemical vapor deposition), sequentially (atomic layer deposition), or in other combinations. For example, the organosilane precursor may be introduced in one pulse and two additional metal sources may be introduced together in a separate pulse [modified atomic layer deposition]. Alternatively, the reaction chamber may already contain the co-reactant prior to introduction of the organosilane precursor. The co-reactant may be passed through a plasma system localized or remotely from the reaction chamber, and decomposed to radicals. Alternatively, the organosilane precursor may be introduced to the reaction chamber continuously while other metal sources are introduced by pulse (pulsed-chemical vapor deposition). In each example, a pulse may be followed by a purge or evacuation step to remove excess amounts of the component introduced. In each example, the pulse may last for a time period ranging from about 0.01 s to about 10 s, alternatively from about 0.3 s to about 3 s, alternatively from about 0.5 s to about 2 s. In another alternative, the organosilane precursor and one or more co-reactants may be simultaneously sprayed from a shower head under which a susceptor holding several wafers is spun (spatial ALD).

In one non-limiting exemplary atomic layer deposition type process, the vapor phase of an organosilane precursor is introduced into the reaction chamber, where it is contacted with a suitable substrate. Excess organosilane precursor may then be removed from the reaction chamber by purging and/or evacuating the reaction chamber. An oxygen source is introduced into the reaction chamber where it reacts with the absorbed organosilane precursor in a self-limiting manner. Any excess oxygen source is removed from the reaction chamber by purging and/or evacuating the reaction chamber. If the desired film is a silicon oxide film, this two-step process may provide the desired film thickness or may be repeated until a film having the necessary thickness has been obtained.

Alternatively, if the desired film is a silicon metal oxide film (i.e., SiMO_(X), wherein x may be 0-4 and M is Ta, Hf, Nb, Mg, Al, Sr, Y, Ba, Ca, As, Sb, Bi, Sn, Pb, Co, lanthanides (such as Er), or combinations thereof), the two-step process above may be followed by the introduction of a second vapor of a metal-containing precursor into the reaction chamber. The metal-containing precursor will be selected based on the nature of the silicon metal oxide film being deposited. After introduction into the reaction chamber, the metal-containing precursor is contacted with the substrate. Any excess metal-containing precursor is removed from the reaction chamber by purging and/or evacuating the reaction chamber. Once again, an oxygen source may be introduced into the reaction chamber to react with the metal-containing precursor. Excess oxygen source is removed from the reaction chamber by purging and/or evacuating the reaction chamber. If a desired film thickness has been achieved, the process may be terminated. However, if a thicker film is desired, the entire four-step process may be repeated. By alternating the provision of the organosilane precursor, metal-containing precursor, and oxygen source, a film of desired composition and thickness can be deposited.

Additionally, by varying the number of pulses, films having a desired stoichiometric M:Si ratio may be obtained. For example, a SiMO₂ film may be obtained by having one pulse of the organosilane precursor and one pulses of the metal-containing precursor, with each pulse being followed by pulses of the oxygen source. However, one of ordinary skill in the art will recognize that the number of pulses required to obtain the desired film may not be identical to the stoichiometric ratio of the resulting film.

In another alternative, Si or dense SiCN films may be deposited via an ALD or modified ALD process using the disclosed compounds and a halosilane compound having the formula Si_(a)H_(2a+2−b)X_(b), wherein X is F, Cl, Br, or I; a=1 through 6; and b=1 through (2a+2); or a cyclic halosilane compound having the formula —Si_(c)H_(2c-d)X_(d)—, wherein X is F, Cl, Br, or I; c=3-8; and d=1 through 2c. Preferably the halosilane compound is trichlorosilane, hexachlorodisilane (HCDS), pentachlorodisilane (PODS), tetrachlorodisilane, or hexachlorocyclohexasilane. One of ordinary skill in the art will recognize that the CI in these compounds may be substituted by Br or I when lower deposition temperatures are necessary, due to the lower bond energy in the Si—X bond (i.e., Si—Cl=456 kJ/mol; Si—Br=343 kJ/mol; Si—I=339 kJ/mol). If necessary, the deposition may further utilize an N-containing co-reactant, such as NH₃. Vapors of the disclosed precursors and the halosilane compounds may be introduced sequentially or simultaneously into the reactor, depending on the desired concentration of the final film. The selected sequence of precursor injection will be determined based upon the desired film composition targeted. The precursor introduction steps may be repeated until the deposited layer achieves a suitable thickness. One of ordinary skill in the art will recognize that the introductory pulses may be simultaneous when using a spatial ALD device. As described in PCT Pub No WO2011/123792, the order of the introduction of the precursors may be varied and the deposition may be performed with or without the NH₃ co-reactant in order to tune the amounts of carbon and nitrogen in the SiCN film.

In yet another alternative, a silicon-containing film may be deposited by the flowable PECVD method disclosed in U.S. Pat. App. Pub. No. 2014/0051264 using the disclosed compounds and a radical nitrogen- or oxygen-containing co-reactant. The radical nitrogen- or oxygen-containing co-reactant, such as NH₃ or H₂O respectively, is generated in a remote plasma system. The radical co-reactant and the vapor phase of the disclosed precursors are introduced into the reaction chamber where they react and deposit the initially flowable film on the substrate. Applicants believe that the sulfur, nitrogen and carbon atoms on the bidentate ligand may help to further improve the flowability of the deposited film, resulting in films having less voids.

The silicon-containing films resulting from the processes discussed above may include Si, SiO₂, SiN, SiON, SiCN, SiCOH, or MSiO_(x), wherein M is an element such as Hf, Zr, Ti, Nb, Ta, or Ge, and x may be 4, depending of course on the oxidation state of M. One of ordinary skill in the art will recognize that by judicial selection of the appropriate organosilane precursor and co-reactants, the desired film composition may be obtained.

Upon obtaining a desired film thickness, the film may be subject to further processing, such as thermal annealing, furnace-annealing, rapid thermal annealing, UV or e-beam curing, and/or plasma gas exposure. Those skilled in the art recognize the systems and methods utilized to perform these additional processing steps. For example, the silicon-containing film may be exposed to a temperature ranging from approximately 200° C. and approximately 1000° C. for a time ranging from approximately 0.1 second to approximately 7200 seconds under an inert atmosphere, a H-containing atmosphere, a N-containing atmosphere, an O-containing atmosphere, or combinations thereof. Most preferably, the temperature is 600° C. for less than 3600 seconds under a H-containing atmosphere. The resulting film may contain fewer impurities and therefore may have improved performance characteristics. The annealing step may be performed in the same reaction chamber in which the deposition process is performed. Alternatively, the substrate may be removed from the reaction chamber, with the annealing/flash annealing process being performed in a separate apparatus. Any of the above post-treatment methods, but especially thermal annealing, has been found effective to reduce carbon and nitrogen contamination of the silicon-containing film.

It will be understood that many additional changes in the details, materials, steps, and arrangement of parts, which have been herein described and illustrated in order to explain the nature of the invention, may be made by those skilled in the art within the principle and scope of the invention as expressed in the appended claims. Thus, the present invention is not intended to be limited to the specific embodiments in the examples given above and/or the attached drawings. 

What is claimed is:
 1. A molecule having the following formula:

wherein L¹ is a sulfur atom and L² is a sulfur atom, an oxygen atom or a nitrogen atom; L¹ and L² being joined together via a carbon bridge having one to three carbon atoms; and L¹, L² and the carbon bridge forming a monoanionic ligand bonded to silicon.
 2. The molecule of claim 1, having the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 3. The molecule of claim 1, having the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 4. The molecule of claim 1, having the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 5. The molecule of claim 1, having the following formula:

wherein R¹, R², and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 6. The molecule of claim 1, having the following formula:

wherein R¹ and R² may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 7. The molecule of claim 1, having the following formula:

wherein R¹ may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 8. The molecule of claim 1, having the following formula:

wherein R¹, R², R³ and R⁴ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 9. The molecule of claim 1, having the following formula:

wherein R¹, R² and R³ may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 10. The molecule of claim 1, having the following formula:

wherein R¹ and R² may be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group.
 11. A method of depositing a Si-containing layer on a substrate, the method comprising: introducing the organosilane precursor of claim 1 into a reactor having a substrate disposed therein; depositing at least part of the organosilane precursor onto the substrate to form a Si-containing layer using a vapor deposition method.
 12. The method of claim 11, further comprising introducing into the reactor a vapor comprising at least one second precursor.
 13. The method of claim 12, wherein an element of the at least one second precursor is selected from the group consisting of group 2, group 13, group 14, transition metal, lanthanides, and combinations thereof.
 14. The method of claim 13, wherein the element of the at least one second precursor is selected from Mg, Ca, Sr, Ba, Zr, Hf, Ti, Nb, Ta, Al, Si, Ge, Y, or lanthanides.
 15. The method of claim 11, further comprising introducing into the reactor at least one co-reactant.
 16. The method of claim 15, wherein the co-reactant is selected from the group consisting of O₂, O₃, H₂O, H₂O₂, NO, NO₂, a carboxylic acid, radicals thereof, and combinations thereof, preferably plasma treated oxygen or ozone.
 17. The method of claim 16, wherein the Si-containing layer is a silicon oxide layer.
 18. The method of claim 15, wherein the co-reactant is selected from the group consisting of H₂, NH₃, (SiH₃)₃N, hydridosilanes (such as SiH₄, Si₂H₆, Si₃H₈, Si₄H₁₀, Si₅H₁₀, Si₆H₁₂), chlorosilanes and chloropolysilanes (such as SiHCl₃, SiH₂Cl₂, SiH₃Cl, Si₂Cl₆, Si₂HCl₅, Si₃Cl₈), alkysilanes (such as Me₂SiH₂, Et₂SiH₂, MeSiH₃, EtSiH₃), hydrazines (such as N₂H₄, MeHNNH₂, MeHNNHMe), organic amines (such as NMeH₂, NEtH₂, NMe₂H, NEt₂H, NMe₃, NEt₃, (SiMe₃)₂NH), pyrazoline, pyridine, B-containing molecules (such as B₂H₆, 9-borabicylo[3,3,1]none, trimethylboron, triethylboron, borazine), alkyl metals (such as trimethylaluminum, triethylaluminum, dimethylzinc, diethylzinc), radical species thereof, and mixtures thereof.
 19. The method of claim 18, wherein the co-reactant is selected from the group consisting of H₂, NH₃, SiH₄, Si₂H₆, Si₃H₈, SiH₂Me₂, SiH₂Et₂, N(SiH₃)₃, hydrogen radicals thereof, and mixtures thereof.
 20. The method of claim 11, wherein the vapor deposition process is a chemical vapor deposition process.
 21. The method of claim 11, wherein the vapor deposition process is an atomic layer deposition process. 